Start-Up Chile and Corfo open application process for startups that have an economic, environmental and social impact.

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Startups from around the world can apply to the second generation of the Huella program, until March 26, 2019. Those who want to participate in the No. 1 accelerator inLatin America, should go to www.startupchile.org or www.corfo.cl and apply according to the bases and instructions.

Until March 26, 2019, startups with less than 5 years of development, from any country in the world and focused on generating social and / or environmental impact as well as economic, may apply to the second generation of Huella, and be part of one of the largest startup communities in the world.

The selected businesses will be able to use Chile as a platform to enter the LATAM market and scale up globally, receive a free equity fund of up to 80,000 USD, access to a large network of investors, mentors and corporate and global partners to scale up to new markets. In addition, a free work space and for foreigners, a 1-year work visa.

For Sebastián Díaz, Executive Director of Start-Up Chile, “Huella will allow entrepreneurs to refine and enhance their value proposition, as well as accelerate the development of their projects through the program.” For his part, for the Executive Vice President of Corfo, Sebastián Sichel, this new generation of Huella “has the best of two worlds: the methodology of Start-Up Chile and the support of Corfo, to develop projects that leave not only their economic footprint, but also deliver an environmental and/or social solution. ”

The most important requirement to apply is that the company has to be a for-profit, impact-driven startups who use technology to solve social andenvironmental problems.To apply, interested entrepeneursmust access the Start-Up Chile website or the Corfo website.

Information for entrepreneurs

The projects will be reviewed by experts in innovation, investors and entrepreneurs, in addition to the Subcommittee for Entrepreneurship in Corfo. The results of this application will be published on Friday, May 17, 2019.